Laser material machining has a history of more than 30 years. In the beginning, simple material processing tasks such as marking or material separation were performed using CO2 and Nd:YAG lasers.
In the course of the development and refinement of laser machining, new fields of application were opened up. The trend revealed ever more precise and high-resolution applications. In order to better correspond to our customers’ requirements, our technology portfolio is further divided into three areas: high-end laser systems, high-end lasers and applications.
Our core competency is micro material-machining—applications comprising µm and sub-µm structurings with solid-state and short-pulse lasers.
We look back on many years of experience in laser micro-machining as both a developer and manufacturer of complex systems. When realizing the tasks at hand, we incorporate the extensive know-how we have gained in R&D projects and through industrial experience.
Our system portfolio comprises micro-marking, micro-structuring and micro-sintering with lasers as well as complex DUV workstations.
The Laser 2000 / 3D-Micromac systems are used in many European countries and, among others, in the optical industry, in mechanical engineering, in the semi-conductor and automotive industries as well as in many universities and research facilities.
Head of business area